Products catalog

Stack Die Technology is becoming essential to combine various functions into one Single Package and to install high capacity Memory. We contribute for production with our various technologies and products lineup.

Semiconductor package materials are increasingly deiversified and the package shape is becoming more complicated. TOWA provides the best solutions and systems for the next generation by the flexible and high speed singulation technologies. Experience and creative ability has produced next...

TOWA is aiming to be a solution company that creates brand-new functions and makes the impossible become possible through its development capabilities. Our products can fulfill the requirements of high grade micro-molds for optics, ultra-precision, and micro-fabrication in all fields. Our unique...

From industrial products to household items, plastic is an indispensable material for just about any field and any industry. Our factory automation for plastic-molding process with our ultra-precision molding and our unique technologies, allows us to meet the high precision and high quality...

Flexible conversion to various product types and saw engines can be added on according to various production capacity. ◆Achieved high throughput with twin cut table and gang head pick＆place. ◆Separate cleaning space enables enough cleaning time for ball / terminal surface. ◆Offload of singulated...

◆A reduced cycle time dramatically improves productivity. ◆The work materials are loaded/unloaded from the front of the machine for easy operation and maintenance. ◆The next level of evolution in TOWA's revolutionary Y Series modular concept. ◆A wide range of optional features are...

Machine Size 3,140～5,060mm(W)×1,550mm(D)×1,850mm(H) Machine Weight 4.5ton～10.2ton

◆Shorter lead time with standardization of options. ◆Flexibility for various production types with increased standardized options. ◆Better cleaning capability with our enhanced dust collector. ◆Operation friendly for Intelligent interfaces.

This is suitable for small volume and various package type production. ◆ Achieved uniform, stable lens shape, and high precision molding ◆ Available 1 or 2 liquid type optional dispenser unit.

Semi-automatic operation offers flexibility for customer's production plan and various production volume. ◆ Press module can be added up to 4 modules with max. 8 strip molding capability. ◆ Achieve uniform, stable lens shape, and high precision molding ◆ Loading substrates by operators and...

Mobile technology innovation requires higher yielding percentage and flexibility with combined different devices on each component. Towa's unique technologies are now essential for higher productivity and thinner packages.

Under the concept "When required", "What required", "Amount required", TOWA provides modular semiconductor manufacturing equipment which deals with numerous types of semiconductor packaging devices, using transfer mold and compression mold methods.